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Navisworks Freedom 2017 32 bit adlmint.dll crack download1. Field of the Invention
The present invention relates to a preparation method of nitride and a preparation method of semiconductor substrate, and more particularly to a preparation method of nitride and a preparation method of semiconductor substrate, in which there is no danger that another substance is generated by mixing with a precursor during the preparation process.
2. Description of the Related Art
Semiconductor light-emitting devices such as laser diodes (LDs) and light-emitting diodes (LEDs) are more and more widely used in the fields of optical communication, optical information, and compact-light-emitting apparatuses because of their small size, low power consumption, and the like. Semiconductor light-emitting devices using nitride-based semiconductor materials such as gallium nitride (GaN) and the like are expected as a next generation light-emitting device. Particularly, nitride-based semiconductor materials having direct transition type bandgaps are capable of realizing blue or green light emission, and therefore, are expected to be applied to, e.g., an LED for a backlight and an LD for an optical information processing device (e.g., CD-ROM, CD-R, and the like).
In the case of nitride-based semiconductor materials, doped layers formed from group III-V semiconductors such as gallium (Ga), which is one of the group III-V semiconductors, indium (In), which is one of the group I-III semiconductors, and nitrogen (N), which is one of the group II elements, are used as a light-emitting layer of a semiconductor light-emitting device. Such a light-emitting layer must be formed on a semiconductor substrate using a thin-film growth apparatus such as a metalorganic chemical vapor deposition (MOCVD) method. A planar type semiconductor light-emitting device is formed by growing the light-emitting layer on a non-oriented substrate, and a wafer type semiconductor light-emitting device is formed by growing a plurality of light-emitting devices on a semiconductor wafer.
As described above, a group III-V semiconductor material as a component of a semiconductor light-emitting device is doped with a group I-III semiconductor material such as gallium (Ga), which is
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